System-on-Chip (SoC) and Multi-Chip Module (MCM) innovations for compact electronic solutions

The modern need to incorporate the maximum functions that can be integrated into a hardware platform while minimizing resource use, power consumption, and space taken is driving the continued rapid development of SoC and MCM technologies. The dense integration of SoCs combined with package-on-package type MCMs has led to very high-density heterogeneous packaging devices. Also, new chip stacking types such as 2.5D and 3D ICs are considered truly SoCs too. However, while SoC technology is unique and truly state-of-the-art compared with any other packaging or integration technologies, MCM technology is interdisciplinary and closely related to chip technology, packaging technology, assembly technology, substrate technology, and chip testing technology.